Chemical polishing of aluminium discs for sale haomei

Chemical polishing of aluminium discs for sale haomei

Chemical polishing is a very important part of the aluminium wafer production process. Nitric acid content control. For phosphoric acid-based chemical polishing baths, the nitric acid content should be maintained within a normal range and daily nitric acid content tests should be carried out. In particular, we need to master the rules for adding nitric acid, which can usually also be adjusted according to practical experience.

When chemical polishing, we need to focus on the relative density of the aluminium discs, as this is directly related. The relative density of the chemically polished bath can be measured with a hydrometer at least once a week, or daily if large quantities are produced by chemical polishing. The relative density of a suitable bath is usually related to the amount of dissolved aluminium and the nitric acid content. If the relative density of the measured bath is too low, it is possible that the chemical polishing bath on the surface of the aluminium wafer has added water, the water may make the polished surface brightness cannot meet the requirements, and may even cause the brightness of the aluminium wafer to deteriorate; if the relative density of the measured bath is high, it is possible that the amount of dissolved aluminium is too high, which will produce defects such as adhesion.